Through silicone vias: Multilayer interconnects for stretchable electronics

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 1567-1571

  Agar, Joshua C ^a   Durden, Jessica ^a   Zhang, Rongwei ^a   Staiculescu, Daniela ^a   Wong, C P ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D PACKAGES; COMPRESSIVE STRAIN; ELECTRICALLY CONDUCTIVE; FORM FACTORS; LAYER-BY-LAYER ASSEMBLY TECHNIQUE; MULTI-LAYER INTEGRATION; PACKAGE DESIGNS; POLYDIMETHYLSILOXANE PDMS; RADIO FREQUENCY DEVICES; STRETCHABLE ELECTRONICS;

APPROXIMATION THEORY; FLEXIBLE ELECTRONICS; MICROCHANNELS; SILICONES;

MULTILAYERS;

EID: 79960412527     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898719     Document Type: Conference Paper

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