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Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 1782-1786

Microstructures of silver films plated on different substrates and annealed at different conditions

(4) Lin, Wen P a Sha, Chu Hsuan a Wang, Pin J a Lee, Chin C a

a UNIVERSITY OF CALIFORNIA (United States)

Author keywords

[No Author keywords available]

Indexed keywords

304 STAINLESS STEEL; ADHESION LAYER; AG FILMS; ANNEALING CONDITION; ANNEALING PROCESS; DIFFERENT SUBSTRATES; GRAIN SIZE; HIGH VACUUM; PREFERRED ORIENTATIONS; SCANNING ELECTRON MICROSCOPES; SEM OBSERVATION; SILVER FILM; SYSTEMATIC EXPERIMENT; XRD; XRD ANALYSIS;

ACTIVATION ENERGY; ADHESION; ANNEALING; COPPER; DIFFRACTION; GOLD; GRAIN GROWTH; GRAIN SIZE AND SHAPE; MICROSTRUCTURE; MORPHOLOGY; SCANNING ELECTRON MICROSCOPY; SILICON; STAINLESS STEEL; SUBSTRATES; THERMAL EVAPORATION; VACUUM EVAPORATION; X RAY DIFFRACTION;

SILVER;

EID: 79960399448 PISSN: 05695503 EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/ECTC.2011.5898754 Document Type: Conference Paper

Times cited : (13)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.