EMC-3D consortium: Targets cost-effective TSV interconnects

Semiconductor International

Volumn 30, Issue 2, 2007, Pages

  Kim, Bioh ^a  

^a Semitool Incorporated   (United States)

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EID: 33846861325     PISSN: 01633767     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

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