High-resolution and high-conductive electrode fabrication on a low thermal resistance flexible substrate

Journal of Micromechanics and Microengineering

Volumn 21, Issue 7, 2011, Pages

  Kang, Bongchul ^a   Kno, Jinsung ^a   Yang, Minyang ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION FORCES; ALTERNATIVE PROCESS; ELECTRICAL CONDUCTIVITY; ELECTRODE FABRICATION; FLEXIBLE SUBSTRATE; HIGH ELECTRICAL CONDUCTIVITY; HIGH RESOLUTION; LASER INDUCED; LIQUID STATE; LOW RESOLUTION; MECHANICAL RELIABILITY; METALLIC INKS; NONLINEAR TRANSFER; PATTERN ADHESION; PATTERN TRANSFERS; PET SUBSTRATE; POLYMER SUBSTRATE; SINTERING TEMPERATURES; SPECIFIC RESISTANCES; THERMAL DAMAGE; THERMALLY STABLE; TRANSFER METHOD;

ADHESION; ELECTRIC CONDUCTIVITY; ELECTRODES; GLASS; INK; ORGANOMETALLICS; POLYETHYLENE TEREPHTHALATES; SINTERING;

SUBSTRATES;

EID: 79960068513     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/21/7/075017     Document Type: Article

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