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Volumn 88, Issue 8, 2011, Pages 1878-1883
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Fabrication of AD/DA microfluidic converter using deep reactive ion etching of silicon and low temperature wafer bonding
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Author keywords
Adhesive bonding; Deep reactive ion etching; Electrowetting on dielectric; Microfluidic converter
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Indexed keywords
DEBONDING;
DROPS;
FABRICATION;
IONS;
MICROFLUIDICS;
SILICON WAFERS;
TEMPERATURE;
WAFER BONDING;
ADHESIVE BONDING;
ANALYTICAL INSTRUMENT;
DEEP REACTIVE ION ETCHING;
DROPLET-BASED MICROFLUIDICS;
ELECTRO-WETTING ON DIELECTRICS;
LOW TEMPERATURE WAFER BONDING;
MICRO FLUIDIC SYSTEM;
TECHNOLOGY DEVELOPMENT;
REACTIVE ION ETCHING;
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EID: 79960067339
PISSN: 01679317
EISSN: None
Source Type: Journal
DOI: 10.1016/j.mee.2010.12.001 Document Type: Conference Paper |
Times cited : (16)
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References (17)
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