Optimization design on packaging materials of high-power LED for lighting

Guangzi Xuebao/Acta Photonica Sinica

Volumn 40, Issue 5, 2011, Pages 663-666

  Liu, Yi Bing ^a,b   Dai, Yu Xing ^a   Huang, Zhi Gang ^b  

^a HUNAN UNIVERSITY   (China)

^b Shaoyang College   (China)

Author keywords

Bonding materials; High power Light Emitting Diode (LED); Packaging; Substrate materials

Indexed keywords

EID: 79959791065     PISSN: 10044213     EISSN: None     Source Type: Journal    
DOI: 10.3788/gzxb20114005.0663     Document Type: Article

References (12)

1. LIU Yi-bing, HUANG Xin-min, LIU Guo-hua. Research of heat relense technology of based on power-LED [J]. Journal of luminating Engineering, 2008, 19 (1): 69-73.
2. NARENDRAN N, GU Y, FREYSSINIER J P, et al. Solid-state lighting: failure analysis of white LEDs [J]. J Crystal Growth, 2004, 268 (3-4): 449-456.
3. HU J Z, YANG L Q, Hwang W J, et al. Thermal and mechanical analysis of delamination in GaN-based light-emitting diode packages [J]. J Crystal Growth, 2006, 288 (1): 157-161.
4. MA Chun-lei, BAO Chao. Study on measurement method of thermal performances for high power LED and its application [J]. Acta Photonica Sinica, 2005, 34 (12): 1803-1806.
5. ZHANG Hai-bing, LÜ Yi-jun, CHEN Huan-ting, et al. Thermal characteristic analysis of high-power LEDs by structure functions [J]. Journal of OptoelectronicsLaser, 2009, 20 (4): 454-457.
6. LI Bing-qian, BU Liang-ji, GAN Xiong-wen, et al. Research on the relationship of the change in forward voltage with temperature of light emitting diode [J]. Acta Photonica Sinica, 2003, 32 (11): 1349-1351.
7. LIU Li-ming, ZHENG Xiao-dong. Measurements of LEDs spectral characteristics and junction temperature [J]. Acta Photonica Sinica, 2009, 38 (5): 1069-1073.
8. VERONIS G, SUH W, LIU Y, et al. Coupled optical and electronic simulations of electrically pumped photonic-crystal-based light-emitting diodes [J]. Journal of Applied Physics, 2005, 97 (4): 044503.
9. WANG Jian, HUANG Xian, LIU Li, et al. Effect of temperature and current on LED luminous efficiency [J]. Chinese Journal of Luminescence, 2008, 29 (2): 358-361.
10. ARIK M, WEAVER S. Chip scale thermal management of high brightness LED package [C]. SPIE, 2004, 5530: 214-223.
11. ARIK M, BECKER C, WEAVER S, et al. Thermal management of LEDs: package to system [C]. SPIE, 2004, 5187: 64-75.
12. WANG Chun-qing, LI Huan-ran. Simulation on temperature field and materials optimization of high-power white LED package [J]. Welding Joining, 2008, (6): 2-5.