Ultrapure water-related problems and waterless cleaning challenges

ECS Transactions

Volumn 34, Issue 1, 2011, Pages 371-376

  Hattori, Takeshi ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

AEROSOL CLEANING; AQUEOUS CLEANING; CAPPING MATERIALS; DEVICE GEOMETRIES; FLOW ELECTRIFICATION; HIGH ASPECT RATIO; HIGH REACTIVITY; HIGH RESISTIVITY; HIGH-K GATE; K-VALUE; POROUS LOW-K; SEMICONDUCTOR MANUFACTURING; SILICON SURFACES; SUPER-CRITICAL; ULTRA-PURE WATER; VAPOR CLEANING; WAFER RINSING; WATER-RELATED PROBLEMS;

ASPECT RATIO; CARBON DIOXIDE; ELECTRIC UTILITIES; HYDROFLUORIC ACID; MANUFACTURE; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS; SURFACE TENSION;

CLEANING;

EID: 79959654468     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3567606     Document Type: Conference Paper

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