Optimization of the adhesion strength of Arc ion plating TiALN films by the taguchi method

Materials

Volumn 2, Issue 2, 2009, Pages 699-709

  Joo, Yun Kon ^a   Zhang, Shi Hong ^a   Yoon, Jae Hon g ^a   Cho, Tong Yul ^a  

^a Changwon National University   (South Korea)

Author keywords

Adhesion strength; Arc ion plating; Taguchi method; TiAlN

Indexed keywords

ARC ION PLATING; COMPETITIVE GROWTH; NEGATIVE BIAS; NITROGEN PRESSURE; PRE-TREATMENT; SUBSTRATE TEMPERATURE; TIALN; WORKING PRESSURES;

ADHESION; BIAS VOLTAGE; BOND STRENGTH (MATERIALS); C (PROGRAMMING LANGUAGE); ELECTRIC ARCS; FILM GROWTH; OPTIMIZATION; TAGUCHI METHODS;

ION IMPLANTATION;

EID: 79959600763     PISSN: None     EISSN: 19961944     Source Type: Journal    
DOI: 10.3390/ma2020699     Document Type: Article

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