Development of Integrated Modular Motor Drive for Traction Applications

SAE International Journal of Engines

Volumn 4, Issue 1, 2011, Pages 286-300

  Choi, Gilsu ^a   Xu, Zhuxian ^b   Li, Ming ^b   Gupta, Shiv ^a   Jahns, Thomas ^a   Wang, Fred ^c   Duffie, Neil A ^a   Marlino, Laura ^b  

^a UNIVERSITY OF WISCONSIN MADISON   (United States)

^b UNIVERSITY OF TENNESSEE   (United States)

^c OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEVICE PACKAGING; DISTRIBUTED CONTROL; FAULT-TOLERANT; HARDWARE TESTBEDS; JUNCTION TEMPERATURES; LAYOUT DESIGNS; MATERIAL SELECTION; MOTOR DRIVE; OPERATING CONDITION; OPERATING TEMPERATURE; PACKAGE DESIGNS; PACKAGING DESIGNS; PACKAGING STRUCTURE; PARASITIC EXTRACTION; PERFORMANCE CHARACTERISTICS; PERFORMANCE TARGETS; PERMANENT-MAGNET MACHINE; PM MACHINES; POWER DENSITIES; RECENT PROGRESS; THERMAL CHARACTERIZATION; THERMAL PERFORMANCE; TRACTION APPLICATIONS; TRACTION DRIVE; TRACTION MOTOR DRIVES;

ACTIVE FILTERS; CONTROLLERS; DESIGN; ELECTRIC DRIVES; INSULATED GATE BIPOLAR TRANSISTORS (IGBT); PACKAGING; PERMANENT MAGNETS; POWER ELECTRONICS; SEMICONDUCTOR JUNCTIONS; SILICON; TEMPERATURE; TRACTION (FRICTION); TRACTION MOTORS;

INTEGRATION;

EID: 79959566140     PISSN: 19463936     EISSN: 19463944     Source Type: Journal    
DOI: 10.4271/2011-01-0344     Document Type: Article

References (14)

1. Brown, N. R., Jahns, T. M., and Lorenz, R. D., "Power Converter Design for an Integrated Modular Motor Drive," in Rec. of 2007 IEEE Industry Applications Society Annual Meeting (IAS'07), pp. 1322-1328, New Orleans, Sept. 2007.
2. Sykora, B. J., Jahns, T. M., and Lorenz, R. D., "Development of a Demonstrator Model of an Integrated Modular Motor Drive," in Proc. 2008 NSF-CPES Annual Conference, Blacksburg, VA, April 2008.
3. Buttay, C., Planson, D., Allard, B., Bergogne, D., Bevilacqua, P., Joubert, C., Lazar, M., Martin, C., Morel, H., Tournier, D., and Raynaud, C., "State of the Art of High Temperature Power Electronics," presented at Microtherm 2009, pp. 1-10, Lodz: Poland, 2009.
4. Ning, P., Lai, R., Wang, F., Ngo, K.D.T., Immanuel, V.D., and Karimi, K.J., "SiC Wirebond Multichip Phase-leg Module Packaging Design and Testing for Harsh Environment," IEEE Transactions on Power Electronics, 25(1):16-23, 2010.
5. Wang, H., Wang, F., Huang, A. Q., and Tipton, C. W., "Investigation of Power MOSFETs for High Temperature Operation," in Rec. of 2005 IEEE Industry Applications Society Annual Meeting (IAS'05), Vol. 1: 388-392, 2005.
6. Schlapbach, U., Rahimo, M., von Arx, C., Mukhitdinov, A., and Linder, S., "1200V IGBTs Operating at 200°C? An Investigation on the Potentials and the Design Constraints," presented at ISPSD 2007, Jeju, South Korea, May 27-31, 2007.
7. EL-Refaie, A. M., "High Speed Operation of PM Machines," PhD thesis, Dept. of Electrical and Computer Eng., University of Wisconsin - Madison, USA, 2005.
8. Jack, A. G., Mecrow, B. C., Dickinson, P. G., Stephenson, D., Burdess, J. S., Fawcett, N., and Evans, J. T., "Permanent Magnet Machines with Powdered Iron Cores and Pressed Windings," IEEE Trans. Industry Applications, 36(4):1077-1084, July/August 2000.
9. Dilts, D. M. et al., "The Evolution of Control Architectures for Automated Manufacturing Systems," J. Manufacturing Syst., 10(1):79-93, 1991.
10. Sheng, W. W., and Colino, R. P., "Power Electronic Modules: Design and Manufacture," CRC press: Boca Raton, 2005.
11. Yamadal, J., Simizu, T., Kawaguchi, M., Nakamural, M., Kikuchi, M., and Thal, E., "The Latest High Performance and High Reliability IGBT Technology in New Packages with Conventional Pin Layout," presented at PCIM 2003, Nuremberg, Germany, May 20-22, 2003.
12. Burress, T. A., Coomer, C. L., Campbell, S. L., Wereszczak, A. A., Cunningham, J. P., Marlino, L. D., Seiber, L. E., and Lin, H. T., "Evaluation of the 2008 Lexus LS 600H Hybrid Synergy Drive System," UT-Battelle, Oak Ridge National Laboratory, Oak Ridge, Tennessee, 2009.
13. Narumanchi, S., Mihalic, M., Kelly, K., and Eesley, G., "Thermal Interface Materials for Power Electronics Applications," presented at ITHERM 2008, Orlando, USA, May 28-31, 2008.
14. Prasher, R., "Thermal Interface Materials: Historical Perspective, Status, and Future Directions," Proceedings of the IEEE, 94(8):1571-1586, 2006.