Hot embossing of high performance polymers

Microsystem Technologies

Volumn 17, Issue 4, 2011, Pages 585-592

  Worgull, M ^a   Kolew, A ^a   Heilig, M ^a   Schneider, M ^a   Dinglreiter, H ^a   Rapp, B ^a  

^a KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

HEATING CONDITIONS; HIGH PERFORMANCE POLYMER; HIGH TEMPERATURE; HOT-EMBOSSING; INJECTION MOULDING; MICRO-ENGINEERING; MOULDING PROCESS; NANO-STRUCTURED; PHYSICAL AND CHEMICAL PROPERTIES; PROCESS CONDITION; PROCESS PARAMETERS; SEMI-CRYSTALLINE POLYMER;

CHEMICAL PROPERTIES; HIGH TEMPERATURE APPLICATIONS; INJECTION MOLDING; PLASTICS MOLDING; THERMOFORMING;

POLYMERS;

EID: 79958778292     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-010-1155-0     Document Type: Conference Paper

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