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Volumn 46, Issue 5 A, 2007, Pages 3139-3143

Evaluation of thermal conductivity of a multi-walled carbon nanotube using the ΔVgs method

Author keywords

Vgs method; Carbon nanotube; Heat dissipation; HEMTs; Methodology; Schottky gate diode; Thermal bump; Thermal conductivity; Thermal resistance

Indexed keywords

HEAT LOSSES; HEAT RESISTANCE; HIGH ELECTRON MOBILITY TRANSISTORS; MICROPROCESSOR CHIPS; SUBSTRATES; THERMAL CONDUCTIVITY;

ALUMINUM NITRIDE; PILLARS; THERMAL SOURCE;

MULTIWALLED CARBON NANOTUBES (MWCN);

EID: 34547915309 PISSN: 00214922 EISSN: 13474065 Source Type: Journal
DOI: 10.1143/JJAP.46.3139 Document Type: Article

Times cited : (11)

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