Influence of side-insulation film on hybrid process of micro EDM and ECM for 3D micro structures

Advanced Materials Research

Volumn 230-232, Issue , 2011, Pages 517-521

  Hu, Manhong ^a   Li, Yong ^a   Zhu, Xiaogu ^a   Tong, Hao ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Hybrid process; Micro ECM; Micro EDM; Side insulated electrode

Indexed keywords

3D MICROSTRUCTURES; 3D STRUCTURE; ELECTRODISCHARGES; FILM EDGE; FILM PROPERTIES; HYBRID PROCESS; HYDROGEN BUBBLES; HYDROPHOBIC FILM; INSULATION FILMS; MACHINING ACCURACY; MACHINING SPEED; MICRO EDM; MICRO-ECM; RESIDUAL MATERIALS; SIDE WALLS; SIDE-INSULATED ELECTRODE; TECHNOLOGICAL METHODS; TOOL ELECTRODE; WORKPIECE MATERIALS;

ELECTRIC DISCHARGE MACHINING; ELECTRIC DISCHARGES; ELECTROCHEMICAL ELECTRODES; HYDROGEN; INSULATING MATERIALS; MANUFACTURE; SILICA; SURFACE STRUCTURE;

THREE DIMENSIONAL;

EID: 79957859636     PISSN: 10226680     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/AMR.230-232.517     Document Type: Conference Paper

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