High-temperature (>500°C) reconfigurable computing using silicon carbide NEMS switches

Proceedings -Design, Automation and Test in Europe, DATE

Volumn , Issue , 2011, Pages 1065-1070

  Wang, Xinmu ^a   Narasimhan, Seetharam ^a   Krishna, Aswin ^a   Wolff, Francis G ^a   Rajgopal, Srihari ^a   Lee, Te Hao ^a   Mehregany, Mehran ^a   Bhunia, Swamp ^a  

^a Case Western Reserve University   (United States)

Author keywords

FPGA; High Temperature Electronics; NEMS; SiC

Indexed keywords

AMBIENT TEMPERATURES; BENCHMARK CIRCUIT; BUILDING BLOCKES; DESIGN COSTS; EFFICIENT DESIGNS; FPGA; HARSH ENVIRONMENT; HIGH RADIATION ENVIRONMENT; HIGH TEMPERATURE; HIGH TEMPERATURE ELECTRONICS; HIGH TEMPERATURE RANGE; INDUSTRIAL SYSTEMS; LOW VOLTAGE OPERATION; NANO-SCALE SIC; PROPULSION SYSTEM; RADIATION HARDNESS; RECONFIGURABLE COMPUTING; RECONFIGURABLE PLAT-FORMS; RELIABLE OPERATION; SI-BASED; SIC; SPECIAL DEVICES; SWITCH PARAMETERS; SWITCH STRUCTURE;

CHEMICAL PROPERTIES; DESIGN; FIELD PROGRAMMABLE GATE ARRAYS (FPGA); MECHANICAL PROPERTIES; PROPULSION; SILICON CARBIDE;

RECONFIGURABLE HARDWARE;

EID: 79957558427     PISSN: 15301591     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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