Diffusion barriers for copper interconnects

International Conference on Solid-State and Integrated Circuit Technology Proceedings

Volumn , Issue , 1998, Pages 238-241

  Oku, Takeo ^a   Mori, Hidetsugu ^a   Murakami, Masanori ^a  

^a KYOTO UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COPPER; CRYSTAL LATTICES; DIFFUSION IN SOLIDS; GRAIN BOUNDARIES; SEMICONDUCTING SILICON; SPUTTERING; TANTALUM COMPOUNDS; THERMODYNAMIC STABILITY; TUNGSTEN COMPOUNDS;

RADIO FREQUENCY SPUTTERING METHODS;

VLSI CIRCUITS;

EID: 0032226719     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (9)