Highly conformal diffusion barriers of amorphous niobium nitride

Materials Research Society Symposium - Proceedings

Volumn 564, Issue , 1999, Pages 335-340

  Gordon, R G ^a   Liu, X ^a   Broomhall Dillard, R N R ^a   Shi, Y ^b  

^a HARVARD UNIVERSITY   (United States)

^b Chemat Technology Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS MATERIALS; CHEMICAL VAPOR DEPOSITION; CONDUCTIVE FILMS; COPPER; DIFFUSION IN SOLIDS; ELECTRON DIFFRACTION; NIOBIUM COMPOUNDS; SUBSTRATES; X RAY DIFFRACTION ANALYSIS;

DIFFUSION BARRIERS; NIOBIUM NITRIDE;

ELECTRIC CONTACTS;

EID: 0033279121     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-564-335     Document Type: Article

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