TiN diffusion barriers for copper metallization

Microelectronic Engineering

Volumn 37-38, Issue , 1997, Pages 221-228

  Baumann, J ^a   Werner, T ^a   Ehrlich, A ^a   Rennau, M ^a   Kaufmann, Ch ^a   Gessner, T ^a  

^a CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Adhesion; Barrier; Cu; Resistivity; Sputtering; Stress; Texture; TiN

Indexed keywords

ADHESION; ANNEALING; COPPER; ELECTRIC CONDUCTIVITY OF SOLIDS; METALLIZING; SILICON WAFERS; STRESS ANALYSIS; SUBSTRATES; TEXTURES; TITANIUM NITRIDE;

DIFFUSION BARRIERS;

MICROELECTRONICS;

EID: 18244422291     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(97)00115-9     Document Type: Article

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