Logic-on-logic 3D integration and placement

IEEE 3D System Integration Conference 2010, 3DIC 2010

Volumn , Issue , 2010, Pages

  Thorolfsson, Thorlindur ^a   Luo, Guojie ^b   Cong, Jason ^b   Franzon, Paul D ^a  

^a North Carolina State University   (United States)

^b Engineering IV   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; ADVANCED ENCRYPTION STANDARD; ANALYTICAL PLACEMENT; CLOCK SPEED; MICRO-BUMPS; MULTIPLE INPUT AND MULTIPLE OUTPUTS; PLACEMENT ALGORITHM; PLACEMENT TOOLS; POWER CONSUMPTION; PROCESSING ELEMENTS; STANDARD-CELL PLACEMENT;

ALGORITHMS; CRYPTOGRAPHY; DATA PRIVACY; ELECTRIC BATTERIES; INTEGRATION; MIMO SYSTEMS;

THREE DIMENSIONAL;

EID: 79955954927     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/3DIC.2010.5751451     Document Type: Conference Paper

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