Monolithic 3D integration of SRAM and image sensor using two layers of single grain silicon

IEEE 3D System Integration Conference 2010, 3DIC 2010

Volumn , Issue , 2010, Pages

  Golshani, Negin ^a   Derakhshandeh, Jaber ^a   Ishihara, Ryoichi ^a   Beenakker, C I M ^a   Robertson, Michael ^b   Morrison, Thomas ^b  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b ACADIA UNIVERSITY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; 6T-SRAM; MONOLITHIC INTEGRATION; PHOTODIODE ARRAYS; PIXEL SIZE; READ-OUT CIRCUIT; SENSOR APPLICATIONS; SILICON LAYER; SINGLE GRAINS; STACKED TRANSISTORS; TWO LAYERS;

IMAGE SENSORS; INTEGRATION; MONOLITHIC INTEGRATED CIRCUITS; PIXELS; SENSORS; STATIC RANDOM ACCESS STORAGE;

THREE DIMENSIONAL;

EID: 79955949068     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/3DIC.2010.5751441     Document Type: Conference Paper

References (8)

1. K. Banerjee, S. J. Souri, P. Kapur, K. C. Saraswat , 3-D ICs: A Novel Chip Design for Improving Deep-Submicrometer Interconnect Performance and Systems-on-Chip Integration, Proceedings of the IEEE, Vol. 89, NO. 5, MAY 2001
2. M. Koyanagi, H. Kurino, K. W. Lee, K. Sakuma, N. Miyakawa, H. Itani, Future system on chip LSI chips, IEEE micro, July-August 1998
3. A. W. Topol, D.C. La Tulipe, L. Shi, D. J. Frank, K. Bernstein et al, Three-dimensional integrated circuits, IBM J. RES. & DEV. VOL. 50 NO. 4/5 JULY/SEPTEMBER 2006
4. V. Rana, R. Ishihara, Y. Hiroshima, S. Inoue, T. Shimoda, W. Metselaar, K. Beenakker, Single-Grain Si TFTs and Circuits Inside Location-Controlled Grains Fabricated Using a Capping Layer of silicon dioxide, IEEE Transactions on Electron Devices, Volume 54, Issue 1, Jan. 2007 Page(s):124-130
5. Jaber Derakhshandeh, M. R. Tajari Mofrad, R. Ishihara and C.I.M Beenakker, Analog and digital output lateral photodiodes fabricated by μ-Czochralski process at low temperature, Device Research Conference 2009, USA
6. Negin Golshani, Jaber Derakhshandeh, R. Ishihara and C.I.M Beenakker, High speed 6T SRAM cells using single grain TFTs fabricated by μ-Czochralski process at low temperature, Japanese Journal of Applied Physics (JJAP) 2010
7. M.R Tajari Mofrad, Jaber Derakhshandeh, R. Ishihara and Cees Beenakker, Monolithic Stacking of Single-Grain Thin-Film Transistors to realize high performance three dimensional integrated circuits, Jpn. J. Appl. Phys., 2009.
8. R. Ishihara, J. Derakhshandeh, M.R. Tajari Mofrad, T. Chen and C.I.M. Beenakker, Monolithic 3D-ICs with Single Grain Si TFTs, Invited paper, AMFPD 2009, Japan