Mechanisms of toughening in silicon nitrides: The roles of crack bridging and microstructure

Acta Materialia

Volumn 59, Issue 10, 2011, Pages 3978-3989

  Funfschilling S ^a   Fett, T ^a   Hoffmann, M J ^a   Oberacker, R ^a   Schwind, T ^a   Wippler, J ^a   Bohlke T ^a   Ozcoban H ^b   Schneider, G A ^b   Becher, P F ^c   Kruzic, J J ^d  

^a KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

^b HAMBURG UNIVERSITY OF TECHNOLOGY   (Germany)

^c OAK RIDGE NATIONAL LABORATORY   (United States)

^d Oregon State University   (United States)

Author keywords

Fracture; Grain boundaries; Microstructure; R curve; Toughness

Indexed keywords

BRIDGING MECHANISM; BRIDGING STRESS; CRACK-BRIDGING; CRACK-GROWTH RESISTANCE; HIGH STRENGTH; INTERFACIAL TOUGHNESS; METAL OXIDES; R-CURVES; SILICON NITRIDE CERAMICS;

CERAMIC MATERIALS; CRACK PROPAGATION; CRACKS; FRACTURE; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MICROSTRUCTURE; SILICON NITRIDE; STRESS CONCENTRATION;

FRACTURE TOUGHNESS;

EID: 79955560944     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2011.03.023     Document Type: Article

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