Debonding of interfaces between beta-silicon nitride whiskers and Si-Al-Y oxynitride glasses

Acta Materialia

Volumn 44, Issue 10, 1996, Pages 3881-3893

  Becher, P F ^a   Sun, E Y ^a   Hsueh, Chun Hway ^a   Alexander, K B ^a   Hwang, Shyh Lung ^a,b   Waters, S B ^a   Westmoreland, C G ^a  

^a OAK RIDGE NATIONAL LABORATORY   (United States)

^b Kaohsiung Polytechnic Institute Taiwan   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BINDING ENERGY; CERAMIC MATERIALS; CHEMICAL BONDS; COMPOSITION EFFECTS; CRACKS; CRYSTAL WHISKERS; GLASS; GRAIN GROWTH; SILICON CARBIDE; THERMAL EXPANSION; THERMAL STRESS;

INDENTATION CRACKING; INTERFACIAL DEBONDING; OXYNITRIDE GLASSES;

INTERFACES (MATERIALS);

EID: 0030271027     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(96)00069-9     Document Type: Article

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