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Volumn 59, Issue 10, 2011, Pages 3937-3945
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Residual plastic strain recovery driven by grain boundary diffusion in nanocrystalline thin films
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Author keywords
Grain boundary diffusion; Nanocrystalline; Plastic strain recovery; Plasticity
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Indexed keywords
A-PLANE;
AVERAGE GRAIN SIZE;
BULGE TESTS;
CHEMICAL POTENTIAL GRADIENT;
COPPER FILMS;
DIFFUSIVE MECHANISMS;
GRAIN-BOUNDARY DIFFUSION;
NANOCRYSTALLINE THIN FILMS;
NANOCRYSTALLINES;
PLASTIC STRAIN RECOVERY;
RESIDUAL STRAINS;
ROOM TEMPERATURE;
STRAIN RECOVERY;
SUBMICRON;
SURFACE CONDITIONS;
TRANSIENT STRAIN;
DIFFUSION;
GRAIN BOUNDARIES;
GRAIN SIZE AND SHAPE;
NANOCRYSTALLINE MATERIALS;
PLASTIC DEFORMATION;
PLASTICITY;
RECOVERY;
UNLOADING;
STRAIN RATE;
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EID: 79955558936
PISSN: 13596454
EISSN: None
Source Type: Journal
DOI: 10.1016/j.actamat.2011.03.019 Document Type: Article |
Times cited : (30)
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References (39)
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