Microstructure and formation of copper oxide in the Cu electro-polishing process

Journal of Nanoscience and Nanotechnology

Volumn 10, Issue 11, 2010, Pages 7065-7069

  Kung, Te Ming ^a   Huang, Michael Rong Shie ^a   Tsao, Jung Chih ^a   Liu, Chuan Pu ^a   Wang, Ying Lang ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

Cyclic voltammetry (CV); Electropolishing; Transmission electron microscopy (TEM); X ray photoelectron spectroscopy (XPS)

Indexed keywords

ANODIC PEAKS; CU FILMS; CU OXIDE; ELECTROLYTE CONCENTRATION; ELECTROPOLISHING; FORMATION-OF-COPPER OXIDES; ION CONCENTRATIONS; MAXIMUM CURRENT DENSITY; VOLTAMMETRY MEASUREMENTS; X-RAY PHOTOELECTRON SPECTROSCOPY (XPS);

BIOELECTRIC PHENOMENA; CONCENTRATION (PROCESS); CYCLIC VOLTAMMETRY; ELECTROLYTES; ELECTROLYTIC POLISHING; ELECTRONS; HEAVY IONS; METALLIC FILMS; MICROSTRUCTURE; OXIDE FILMS; PHOSPHORIC ACID; PHOTOELECTRICITY; PHOTONS; TRANSMISSION ELECTRON MICROSCOPY; X RAY CRYSTALLOGRAPHY; X RAY PHOTOELECTRON SPECTROSCOPY; X RAYS;

COPPER;

EID: 79955544723     PISSN: 15334880     EISSN: None     Source Type: Journal    
DOI: 10.1166/jnn.2010.2899     Document Type: Conference Paper

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