Enhanced flow boiling heat transfer with jet impingement on micro-pin-finned surfaces

Applied Thermal Engineering

Volumn 31, Issue 11-12, 2011, Pages 2042-2051

  Guo, D ^a   Wei, J J ^a   Zhang, Y H ^a  

^a XI'AN JIAOTONG UNIVERSITY   (China)

Author keywords

flow boiling; heat transfer enhancement; jet impingement; Micro pin fin

Indexed keywords

CHIP SURFACES; CRITICAL HEAT FLUX; CROSSFLOW VELOCITIES; DRY ETCHING TECHNIQUES; ENHANCED FLOW BOILING; FIN DIMENSIONS; FINNED SURFACE; FLOW BOILING; HEAT TRANSFER ENHANCEMENT; JET IMPINGEMENT; JET VELOCITIES; LIQUID SUBCOOLING; MICRO PIN FINS; MICRO-PIN-FIN; SILICON CHIP; SMOOTH SURFACE; SUBCOOLED FLOW BOILING;

BOILING LIQUIDS; COOLING SYSTEMS; EXPERIMENTS; FINS (HEAT EXCHANGE); HEAT TRANSFER COEFFICIENTS; JETS; PHASE TRANSITIONS; PLASMA ETCHING;

HEAT FLUX;

EID: 79955464975     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2011.03.017     Document Type: Article

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