Subcooled flow boiling heat transfer of FC-72 from silicon chips fabricated with micro-pin-fins

International Journal of Thermal Sciences

Volumn 48, Issue 7, 2009, Pages 1416-1422

  Yuan, Minzhe ^a   Wei, Jinjia ^a   Xue, Yanfang ^a   Fang, Jiabin ^a  

^a XI'AN JIAOTONG UNIVERSITY   (China)

Author keywords

FC 72; Flow boiling; Heat transfer; High heat flux; Micro pin fin

Indexed keywords

BOILING HEAT TRANSFER ENHANCEMENTS; CRITICAL HEAT FLUXES; DRY ETCHING TECHNIQUES; FC-72; FIN HEIGHTS; FIN PITCHES; FIN-THICKNESS; FINNED SURFACES; FLOW BOILING; FLOW BOILING HEAT TRANSFERS; FLUID VELOCITIES; HEAT TRANSFER ENHANCEMENTS; HIGH HEAT FLUX; LSI CHIPS; MICRO-PIN-FIN; MICRO-PIN-FINS; RELIABLE OPERATIONS; SHARP INCREASE; SILICON CHIPS; SMOOTH SURFACES; SUB-COOLING; SUBCOOLED FLOW BOILING; SUBCOOLINGS; WALL TEMPERATURES;

COMPUTATIONAL FLUID DYNAMICS; COOLING SYSTEMS; FINS (HEAT EXCHANGE); HEAT EXCHANGERS; HEAT FLUX; HEAT TRANSFER COEFFICIENTS; PLASMA ETCHING; STRUCTURAL PANELS; THERMONUCLEAR REACTIONS;

BOILING LIQUIDS;

EID: 64949116622     PISSN: 12900729     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijthermalsci.2008.11.018     Document Type: Article

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