Microchip cooling module based on FC72 slot jet arrays without cross-flow

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn 2006, Issue , 2006, Pages 54-58

  Fabbri, M ^a   Wetter, A ^a   Mayer, B ^a   Brunschwiler, T ^a   Michel, B ^a   Rothuizen, H ^a   Linderman, R ^a   Kloter, U ^a  

^a IBM RESEARCH ZURICH   (Switzerland)

Author keywords

Boiling; High power density; Impingement cooling

Indexed keywords

ARRAYS; BOILING LIQUIDS; COOLING; DENSITY (SPECIFIC GRAVITY); INTAKE SYSTEMS; JETS; NOZZLES;

HIGH POWER DENSITY; IMPINGEMENT COOLING; LIQUID BASED COOLING; MICROCHIP COOLING MODULE;

MICROPROCESSOR CHIPS;

EID: 33750097771     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Webb, B.W. and Ma, C.F., "Single-phase liquid jet impingement heat transfer," Advances in Heat Transfer, Vol. 26, pp. 105-217, 1995.
2. Wolf, D.H., Incropera, F.P., and Viskanta, R., "Jet impingement boiling," Advances in Heat Transfer, Vol. 23, pp. 1-132, 1993.
3. Fabbri, M., Jiang, S., and Dhir, V.K., "A comparative study of cooling of high power density electronics using sprays and microjets," Journal of Heat Transfer, Vol. 127, pp. 38-48, 2005.
4. Fabbri, M. and Dhir, V.K., "Optimized heat transfer for high power electronic cooling using arrays of microjets," Journal of Heat Transfer, Vol. 127, pp. 760-769, 2005.
5. Wetter, A. and Mayer, B., "Design and characterization of a 2-phase liquid cooling test vehicle for microprocessor cooling," Diploma Thesis, Interstaatliche Hochschule für Technik, Buchs, Switzerland, 2004.
6. Wang, N., Zhang, L., Jiang, L., Koo, J. -M., Maveety, J. G., Sanchez, E.A., Goodson, K.E., and Kenny, T.W., "Micromachined Jets of Liquid Impingement Cooling of VLSI Chips," J. of MEMS, Vol. 13, No. 5, pp. 833-842, 2004.
7. st IEEE SEMI-THERM Symp., San Jose', CA, 2005.