Cooling of electronic components with free jet impingement boiling

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 387-394

  Tay, A A O ^a   Xue, Hong ^b   Yang, Cheng ^c  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b CALIFORNIA STATE POLYTECHNIC UNIVERSITY   (United States)

^c NONE

Author keywords

Electronic components; Electronic packaging thermal management; Electronics cooling; Heat engines; Heat transfer; Mechanical engineering; Temperature; Thermal management; Thermal management of electronics; Thermal stresses

Indexed keywords

COOLING; ELECTRONIC COOLING; ELECTRONICS PACKAGING; HEAT ENGINES; HEAT FLUX; HEAT TRANSFER; HEAT TRANSFER COEFFICIENTS; JETS; MECHANICAL ENGINEERING; NUCLEATION; PROBABILITY DISTRIBUTIONS; STRESSES; TEMPERATURE; TEMPERATURE CONTROL; THERMAL STRESS; THERMAL VARIABLES CONTROL; THICK FILMS; VELOCITY;

COOLING OF ELECTRONICS; CRITICAL HEAT FLUX(CHF); ELECTRONIC COMPONENT; ELECTRONIC PACKAGING THERMAL MANAGEMENTS; ELECTRONICS COOLING; HEAT DISSIPATION RATES; JET IMPINGEMENT BOILING; SINGLE PHASE HEAT TRANSFERS;

FIGHTER AIRCRAFT;

EID: 69949093361     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2002.1012482     Document Type: Conference Paper

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