Generation mechanism of electrochemical migration in printed wiring board insulation

IEEJ Transactions on Electrical and Electronic Engineering

Volumn 6, Issue 3, 2011, Pages 200-206

  Natsui, Masashi ^a   Asakawa, Hiroki ^a   Tanaka, Toshikatsu ^a   Ohki, Yoshimichi ^a   Maeno, Takashi ^b   Okamoto, Kenji ^c  

^a WASEDA UNIVERSITY   (Japan)

^b NATIONAL INSTITUTE OF INFORMATION AND COMMUNICATIONS TECHNOLOGY   (Japan)

^c FUJI ELECTRIC CO   (Japan)

Author keywords

Electrochemical migration; Epoxy resin; Paper phenol resin composite; Printed wiring board; Pulsed electroacoustic method; Space charge

Indexed keywords

ADHESIVES; ATMOSPHERIC HUMIDITY; CARRIER MOBILITY; ELECTRIC FIELDS; ELECTRIC SPACE CHARGE; ELECTROCHEMISTRY; NANOCOMPOSITE FILMS; PRINTED CIRCUIT BOARDS; SYNTHETIC RESINS;

ELECTROCHEMICAL MIGRATION; PAPER/PHENOL-RESIN COMPOSITE; PRINTED WIRING BOARDS; PULSED ELECTRO-ACOUSTIC METHOD; SPACE CHARGE;

EPOXY RESINS;

EID: 79953898183     PISSN: 19314973     EISSN: 19314981     Source Type: Journal    
DOI: 10.1002/tee.20645     Document Type: Article

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