Observation of copper ionic migration in insulation layer by pulsed electroacoustic method

IEEE Transactions on Components and Packaging Technologies

Volumn 25, Issue 2, 2002, Pages 239-243

  Okamoto, Kenji ^b   Fukunaga, Kaori ^a,c,d   Maeno, Takashi ^d   Tsukui, Tsutomu ^e,f  

^a IEEE

^b FUJI ELECTRIC CO   (Japan)

^c FUJIKURA LTD   (Japan)

^d NATIONAL INSTITUTE OF INFORMATION AND COMMUNICATIONS TECHNOLOGY   (Japan)

^e HITACHI LTD   (Japan)

^f TOKAI UNIVERSITY   (Japan)

Author keywords

Insulation layer; Ionic impurities; Ionic migration; Metal base PWB; Pulsed electroacoustic method; Space charge

Indexed keywords

ACOUSTOELECTRIC EFFECTS; ANODES; ATMOSPHERIC HUMIDITY; COPPER; ELECTRIC SPACE CHARGE; IMPURITIES; INSULATION; NONDESTRUCTIVE EXAMINATION; POLARIZATION;

COPPER IONIC MIGRATION;

ELECTRONICS PACKAGING;

EID: 0036613208     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2002.1010012     Document Type: Article

References (5)

1. Design constraints for the use of insulated metal substrates
2. Insulated metal substrates for the frabrication of a halfbridge power hybrid
3. Copper ion migration in insulated metal substrates
4. Dielectric property of copper ionic migration at insulation layer on metal-base PWB
5. High-resolution PEA charge distribution measurement system