Creepage breakdown characteristics in printed wiring board in silicone gel

Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Annual Report

Volumn 2, Issue , 1996, Pages 734-737

  Maeda, Takahiko ^a   Haga, Kohji ^a   Maeda, Takao ^a  

^a FUJI ELECTRIC CO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC BREAKDOWN OF SOLIDS; ELECTRODES; EPOXY RESINS; GELS; GLASS; PERMITTIVITY; PRINTED CIRCUIT BOARDS; SILICONES; SUBSTRATES; VOLTAGE MEASUREMENT;

CREEPAGE BREAKDOWN; INSULATION SUBSTRATES; SILICONE GELS;

ELECTRIC INSULATING MATERIALS;

EID: 0030409686     PISSN: 00849162     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)