Detection of ion migration in composites for printed circuit boards by the pulsed electroacoustic method

Proceedings of the International Symposium on Electrical Insulating Materials

Volumn , Issue , 2008, Pages 376-379

  Natsui, M ^a   Echigo, Y ^a   Tanaka, T ^a   Ohki, Y ^a   Maeno, T ^b  

^a WASEDA UNIVERSITY   (Japan)

^b NATIONAL INSTITUTE OF INFORMATION AND COMMUNICATIONS TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTOELECTRIC EFFECTS; BUILDING MATERIALS; CARBON FIBER REINFORCED PLASTICS; COPPER; ELECTROMAGNETIC WAVE EMISSION; ELECTRONIC EQUIPMENT MANUFACTURE; INSULATING MATERIALS; INSULATION; PIEZOELECTRIC DEVICES; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; RESINS;

CU MIGRATIONS; GLASS/EPOXY; ION MIGRATIONS; NONDESTRUCTIVE TECHNIQUES; PEA METHODS; POSITIVE CHARGES; PULSED ELECTRO ACOUSTIC METHODS; RESIN COMPOSITES; THICKNESS DIRECTIONS;

PRINTED CIRCUIT BOARDS;

EID: 58049084341     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISEIM.2008.4664459     Document Type: Conference Paper

References (11)

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