Low temperature conformal silicon dioxide deposition using supercritical fluid for polymer-based MEMS

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2011, Pages 49-52

  Yamada, H ^a   Momose, T ^a,b   Kitamura, Y ^c   Hattori, Y ^c   Shimogaki, Y ^a,d   Sugiyama, M ^a,d  

^a BEANS Project   (Japan)

^b INSTITUTE OF INDUSTRIAL SCIENCE   (Japan)

^c DENSO CORPORATION   (Japan)

^d UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION TEMPERATURES; INNER WALLS; LOW TEMPERATURES; POLYDIMETHYLSILOXANE PDMS; POLYMER-BASED MEMS; SILICON DIOXIDE; SUPERCRITICAL FLUID DEPOSITION;

ASPECT RATIO; EFFLUENT TREATMENT; MECHANICAL ENGINEERING; MECHANICS; MICROCHANNELS; POLYMERS; REACTIVE ION ETCHING; SILICA; SILICON OXIDES; SILICONES; SUPERCRITICAL FLUIDS;

MEMS;

EID: 79953782661     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2011.5734359     Document Type: Conference Paper

References (8)

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8. 2 LAYERS BY SUPERCRITICAL FLUID DEPOSITION", Proc. MEMS 2011, in press.