Thermal nanoimprint process for high-temperature fabrication of mesoscale epitaxial exchange-biased metallic wire arrays

Journal of Micromechanics and Microengineering

Volumn 21, Issue 4, 2011, Pages

  Zhang, W ^a   Weiss, D N ^a,b   Krishnan, K M ^a  

^a University of Washington   (United States)

^b Washington Technology Center   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

A-THERMAL; BI-LAYER; BILAYER RESISTS; COMPETING EFFECTS; CRYSTALLOGRAPHIC ORIENTATIONS; DEFECT-FREE; ETCH PARAMETERS; HIGH TEMPERATURE; MAGNETIC MEASUREMENTS; MAGNETOCRYSTALLINE; MESOSCALE; METALLIC WIRE ARRAY; MGO SUBSTRATE; PATTERNED ARRAYS; POLYMERIC RESIST; SHAPE ANISOTROPY; SUBMICRON; TETRAFLUOROETHYLENE; THERMAL NANOIMPRINT; WIRE ARRAYS;

EPITAXIAL GROWTH; ETHYLENE; FLUORINE CONTAINING POLYMERS; MOLYBDENUM; NANOIMPRINT LITHOGRAPHY; POLYMERS; WIRE; X RAY DIFFRACTION;

MAGNETIZATION REVERSAL;

EID: 79953670611     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/21/4/045024     Document Type: Article

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