Test beam results of 3D silicon pixel sensors for the ATLAS upgrade

Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Volumn 638, Issue 1, 2011, Pages 33-40

  Grenier, P ^q   Alimonti, G ⁿ   Barbero, M ^b   Bates, R ^h   Bolle, E ^p   Borri, M ^m   Boscardin, M ^v   Buttar, C ^h   Capua, M ^c   Cavalli Sforza, M ^j   Cobal, M ^t   Cristofoli, A ^t   Dalla Betta, G F ^s   Darbo, G ^g   Da Via C ^m   Devetak, E ^r   Dewilde, B ^r   Di Girolamo, B ^d   Dobos, D ^d   Einsweiler, K ^l   Esseni, D ^t   Fazio, S ^c   Fleta, C ^u   Freestone, J ^m   Gallrapp, C ^d   Garcia Sciveres, M ^l   Gariano, G ^g   Gemme, C ^g   Giordani, M P ^t   Gjersdal, H ^p   Grinstein, S ^k   Hansen, T ^w   Hansen, T E ^w   Hansson, P ^q   Hasi, J ^q   Helle, K ^a   Hoeferkamp, M ^o   Hugging F ^b   Jackson, P ^q   Jakobs, K ^f   Kalliopuska, J ^x   Karagounis, M ^b   Kenney, C ^q   Kohler M ^f   Kocian, M ^q   Kok, A ^w   Kolya, S ^m   Korokolov, I ^j   Kostyukhin, V ^b   Kruger H ^b   La Rosa, A ^d   Lai, C H ^m   Lietaer, N ^w   Lozano, M ^u   Mastroberardino, A ^c   Micelli, A ^t   Nellist, C ^m   Oja, A ^x   Oshea, V ^h   Padilla, C ^j   Palestri, P ^t   Parker, S ⁱ   Parzefall, U ^f   Pater, J ^m   Pellegrini, G ^u   Pernegger, H ^d   Piemonte, C ^v   Pospisil, S ^e   Povoli, M ^s   Roe, S ^d   Rohne, O ^p   Ronchin, S ^v   Rovani, A ^g   Ruscino, E ^g   Sandaker, H ^a   Seidel, S ^o   Selmi, L ^t   Silverstein, D ^q   Sjobaek K ^p   Slavicek, T ^e   Stapnes, S ^p   Stugu, B ^a   Stupak, J ^r   Su, D ^q   Susinno, G ^c   Thompson, R ^m   Tsung, J W ^b   Tsybychev, D ^r   Watts, S J ^m   Wermes, N ^b   Young, C ^q   Zorzi, N ^v   more..

^a UNIVERSITY OF BERGEN   (Norway)

^b UNIVERSITY OF BONN   (Germany)

^c UNIVERSITY OF CALABRIA   (Italy)

^d CERN   (Switzerland)

^e CZECH TECHNICAL UNIVERSITY IN PRAGUE   (Czech Republic)

^f UNIVERSITY OF FREIBURG   (Germany)

^g INFN SEZIONE DI GENOVA   (Italy)

^h UNIVERSITY OF GLASGOW   (United Kingdom)

ⁱ UNIVERSITY OF HAWAII   (United States)

^j BARCELONA INSTITUTE OF SCIENCE AND TECHNOLOGY   (Spain)

^k INSTITUCIÓ CATALANA DE RECERCA I ESTUDIS AVANÇATS ICREA   (Spain)

^l LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

^m UNIVERSITY OF MANCHESTER   (United Kingdom)

ⁿ INFN SEZIONE DI MILANO   (Italy)

^o UNIVERSITY OF NEW MEXICO   (United States)

^p UNIVERSITY OF OSLO   (Norway)

^q SLAC NATIONAL ACCELERATOR LABORATORY   (United States)

^r STONY BROOK UNIVERSITY   (United States)

^s INFN TIFPA   (Italy)

^t UNIVERSITY OF UDINE   (Italy)

^u INSTITUTO DE MICROELECTRÓNICA DE BARCELONA   (Spain)

^v ITC IRST   (Italy)

^w SINTEF   (Norway)

^x VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

more..

Author keywords

3D sensors; ATLAS upgrade; Radiation hard detectors; Silicon sensors

Indexed keywords

3D SENSOR; ATLAS PIXEL DETECTORS; ATLAS UPGRADE; BEAM TESTS; CHARGE COLLECTION; CHARGE SHARING; FRONT-END CHIPS; INCIDENT ANGLES; INNER DETECTOR; PIXEL CELLS; RADIATION HARD DETECTORS; SILICON PIXEL SENSORS; TEST BEAM; WAFER THICKNESS;

ELECTRODES; MAGNETIC FIELDS; PIXELS; RADIATION DETECTORS; SILICON DETECTORS; SILICON SENSORS; SILICON WAFERS;

THREE DIMENSIONAL;

EID: 79953329955     PISSN: 01689002     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.nima.2011.01.181     Document Type: Article

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