Electrospray cooling for microelectronics

International Journal of Heat and Mass Transfer

Volumn 54, Issue 11-12, 2011, Pages 2270-2275

  Deng, Weiwei ^a   Gomez, Alessandro ^b  

^a UNIVERSITY OF CENTRAL FLORIDA   (United States)

^b Yale University   (United States)

Author keywords

Electrospray; MEMS; Spray cooling

Indexed keywords

CHARGED MICRODROPLETS; CONDUCTING SURFACES; CONE-JET MODE; COOLING EFFICIENCY; ELECTRICALLY CHARGED DROPLET; ELECTROSPRAYS; HIGH HEAT FLUX; IMAGE FORCE; MICROELECTRONIC CHIP; MICROFABRICATED; SCALE-UP; SEMICONDUCTOR INDUSTRY; SPRAY COOLING;

COOLING SYSTEMS; DROPS; HEAT FLUX; MICROELECTRONICS; MICROFABRICATION; MULTIPLEXING; SEMICONDUCTOR DEVICE MANUFACTURE; SPRAY STEELMAKING; THERMONUCLEAR REACTIONS;

COOLING;

EID: 79953042130     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijheatmasstransfer.2011.02.038     Document Type: Article

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