The enhancement ratio of corresponding convection heat transfer coefficient using electrospray evaporative cooling system

Proceedings of the ASME Summer Heat Transfer Conference 2009, HT2009

Volumn 1, Issue , 2009, Pages 1013-1020

  Wang, H C ^a   Hsu, C P ^a   Mamishev, A V ^a  

^a University of Washington   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

A-THERMAL; CONVECTION HEAT TRANSFER COEFFICIENTS; COOLING TECHNOLOGY; DC POTENTIAL; ELECTROSPRAY MODES; ELECTROSPRAY TECHNIQUES; ELECTROSPRAYS; ELECTROSTATIC FIELD; ENHANCEMENT RATIOS; EVAPORATIVE COOLING; HEAT FLUX DENSITIES; HEAT REMOVAL; HEAT TRANSFER PERFORMANCE; HIGH HEAT FLUX REMOVAL; NOZZLE ARRAYS; PER UNIT; REGRESSION CURVE; THERMAL IMAGES; THERMAL MANAGEMENT; VOLUME FLOW RATE;

ETHANOL; EVAPORATION; EVAPORATIVE COOLING SYSTEMS; HEAT CONVECTION; HEAT EXCHANGERS; HEAT FLUX; HEAT TRANSFER COEFFICIENTS; MICROELECTRONICS; SPRAY NOZZLES; TEMPERATURE CONTROL; THERMAL SPRAYING;

COOLING;

EID: 77952821786     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/HT2009-88629     Document Type: Conference Paper

References (12)

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