Metallization of branched DNA origami for nanoelectronic circuit fabrication

ACS Nano

Volumn 5, Issue 3, 2011, Pages 2240-2247

  Liu, Jianfei ^a   Geng, Yanli ^b   Pound, Elisabeth ^b   Gyawali, Shailendra ^a   Ashton, Jeffrey R ^b   Hickey, John ^a   Woolley, Adam T ^b   Harb, John N ^a  

^a Brigham Young University   (United States)

^b Brigham Young University   (United States)

Author keywords

Au; DNA metallization; DNA origami; electroless deposition; nanoelectronic circuits; nanowire

Indexed keywords

AU; BRANCHED DNA; CIRCUIT FABRICATION; DNA-TEMPLATE; ELECTROLESS DEPOSITION; ELECTROLESS DEPOSITION PROCESS; EXPERIMENTAL CONDITIONS; METAL DEPOSITION; METALLIZATIONS; NANOCIRCUITS; NANOELECTRONIC CIRCUITS; ROBUST METHODS; SIGNIFICANT IMPACTS; TEMPLATED;

DNA; GOLD COATINGS; METALLIZING; NANOELECTRONICS; NANOWIRES;

NUCLEIC ACIDS;

DNA; METAL; NANOMATERIAL;

ARTICLE; CHEMISTRY; ELECTRONICS; EQUIPMENT; EQUIPMENT DESIGN; INSTRUMENTATION; NANOTECHNOLOGY; PARTICLE SIZE; ULTRASTRUCTURE;

DNA; ELECTRONICS; EQUIPMENT DESIGN; EQUIPMENT FAILURE ANALYSIS; METALS; NANOSTRUCTURES; NANOTECHNOLOGY; PARTICLE SIZE;

EID: 79952972051     PISSN: 19360851     EISSN: 1936086X     Source Type: Journal    
DOI: 10.1021/nn1035075     Document Type: Article

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