Anisothermal anodic bonding: A method to control global curvature and residual stress

ECS Transactions

Volumn 33, Issue 4, 2010, Pages 563-572

  Yadav, M ^a   Lin, T W ^a   Johnson, H T ^a   Horn, G P ^a  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

RESIDUAL STRESSES; SILICON WAFERS; SUBSTRATES; THERMAL EXPANSION;

BONDED STRUCTURE; QUANTITATIVE MODELING; SILICON BONDING; SILICON ON GLASS; THERMAL EXPANSION MISMATCH; THERMAL VARIATION; THERMO-MECHANICAL FINITE ELEMENT MODELS; WAFER TEMPERATURE;

WAFER BONDING;

EID: 79952663854     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3483548     Document Type: Conference Paper

References (19)

1. K.M. Knowles and A.T.J van Helvoort, Inst. Mate.r Miner. Min., 51(5), 273 (2006).
2. H. Henmi, S. Shoji, Y. Shoji, K. Yoshimi K, and M. Esashi, Sensor. Actual A-Phys., 43(1-3), 243 (1994).
3. T. Rogers, N. Aitken, K. Stribley, and J. Boyd, Sensor. Actual A-Phys., 123-124, 106 (2005).
4. H. Moriceau, O. Rayssac, B. Aspar and B. Ghyselen, in Semiconductor Wafer Bonding VII: Science, Technology, and Applications 19, p. 49 (2003).
5. M. Harz and H. Engelke, Sensor. Actual A-Phys., 55(2-3), 201(1996).
6. M. Harz and W. Bruckner, J. Electrochem. Soc., 143(4), 1409 (1996).
7. A. Cozma and B. Puers B, J. Micromech. Microeng., 5(2), 98 (1995).
8. G.P. Horn, R. Gerbach, T-W. Lin, M. Bemach, S. Brand and H. T. Johnson, these proceedings.
9. D.J. Green, J. Mater. Sci., 19(7), 2165 (1984).
10. R. Tandon and D.J. Green, J. Am. Ceram. Soc., 74(8), 1981 (1991).
11. D.J. Green, R. Tandon and V.M. Sglavo, Science 283(5406), 1295(1999).
12. R.B. Roberts, J. Applied Physics D, 14, (1981).
13. W.H. Ko, J. T. Suminto and G. J. Yeh, Studies in electrical and Electronics engineering,20 41(1985).
14. T. Rogers, J. Micromech. Microeng., 2(3), 164 (1992).
15. T. Rogers and J. Kowal, Sensor. Actual A-Phys., 46(1-3), 113, (1995).
16. J. Wei, H. Xie, M.L. Nai, C.K. Wong, and L.C. Lee, J. Micromech. Microeng., 13(2) 217 (2003).
17. D.-J. Lee, B.-K. Ju, J. Jang, K.-B. Lee and M.-H. Oh, J. Micromech. Microeng., 9(4), 318 (1999).
18. J.S. Go, and Y.-H. Cho, Sensor. Actual A-Phys., 73(1-2), 57 (1999).
19. R. A. Inzinga, T.-W. Lin, M. Yadav, H. T. Johnson, G. P. Horn, "Characterization and control of residual stress and curvature in anodically bonded MEMS devices with etched features", in preparation