Stress reduction in anodically bonded silicon and borosilicate glass by thermal treatment

Journal of the Electrochemical Society

Volumn 143, Issue 4, 1996, Pages 1409-1414

  Harz, Michael ^a   Brückner, Winfried ^b  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

^b IFW DRESDEN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; BENDING (FORMING); BONDING; BOROSILICATE GLASS; CHEMICAL RELAXATION; GLASS TRANSITION; SILICON WAFERS; THERMAL STRESS;

ANODIC BONDING; ANODICALLY BONDED SILICON; BOWING; LASER OPTICAL CURVATURE MEASUREMENT;

SEMICONDUCTING SILICON;

EID: 0030130376     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1836652     Document Type: Article

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