Bias-assisted KOH etching of macroporous silicon membranes

Journal of Micromechanics and Microengineering

Volumn 21, Issue 3, 2011, Pages

  Mathwig, K ^a   Geilhufe, M ^a   Muller F ^a   Gosele U ^a  

^a MAX PLANCK INSTITUTE OF MICROSTRUCTURE PHYSICS   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT-TIME CHARACTERISTICS; FABRICATION PROCESS; KOH ETCHING; MACRO POROUS SILICON; PORE WALL; POROUS MEMBRANES; SILICON DIOXIDE; STARTING MATERIALS; TUBE ARRAYS;

DISSOLUTION; ETCHING; POTASSIUM; POTASSIUM HYDROXIDE; PROCESS CONTROL; SEMICONDUCTING SILICON COMPOUNDS; SILICA; SILICON WAFERS;

POROUS SILICON;

EID: 79952636171     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/21/3/035015     Document Type: Article

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