Relaxation times and in situ kinetic analysis during network evolution of epoxy via a nickel catalyst of imidazole

Thermochimica Acta

Volumn 516, Issue 1-2, 2011, Pages 52-57

  Omrani, Abdollah ^a,b   Mollova, Ayret ^a   Mattea, Carlos ^a   Stapf, Siegfried ^a  

^a ILMENAU UNIVERSITY OF TECHNOLOGY   (Germany)

^b UNIVERSITY OF MAZANDARAN   (Iran)

Author keywords

Cure kinetics; Epoxy resin; Low field NMR; Relaxation time

Indexed keywords

CURE KINETICS; CURING AGENTS; CURING SCHEDULE; DEGREE OF CURE; ELEVATED TEMPERATURE; HIGH TEMPERATURE; HIGH-FIELD NMR; IN-SITU; ISOTHERMAL TEMPERATURE; KINETIC STUDY; LOW FIELD NMR RELAXOMETRY; LOW-FIELD NMR; METAL ORGANIC; NETWORK EVOLUTION; NICKEL CATALYST; NMR TECHNIQUES; ON-LINE PROCESS MONITORING; ONE POT; STORAGE STABILITY;

CATALYSTS; CURING; ENGINEERING RESEARCH; EPOXY RESINS; NUCLEAR MAGNETIC RESONANCE SPECTROSCOPY; ONLINE SYSTEMS; ORGANOMETALLICS; PROCESS MONITORING; RELAXATION TIME; SYNTHETIC RESINS;

RATE CONSTANTS;

EID: 79952438590     PISSN: 00406031     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tca.2011.01.012     Document Type: Article

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