Curing of an epoxy resin modified with poly(methylmethacrylate) monitored by simultaneous dielectric/near infrared spectroscopies

European Polymer Journal

Volumn 40, Issue 1, 2004, Pages 129-136

  Kortaberria, G ^a   Arruti, P ^a   Gabilondo, N ^a   Mondragon, I ^a,b  

^a UNIVERSITY OF THE BASQUE COUNTRY UPV EHU   (Spain)

^b Escuela Universitaria Politecnica   (Spain)

Author keywords

Relaxation; Curing; Dielectric spectroscopy; Epoxy; Near infrared

Indexed keywords

CURING; DIELECTRIC RELAXATION; EPOXY RESINS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; GELATION; HYDROGEN BONDS; IONIC CONDUCTION; POLYMER BLENDS; RHEOLOGY; SOLVENT EXTRACTION;

MOLECULAR MOBILITY; NEAR INFRARED SPECTROSCOPY (NIR);

POLYMETHYL METHACRYLATES;

EID: 0347355008     PISSN: 00143057     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.eurpolymj.2003.09.009     Document Type: Conference Paper

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