Study on curing mechanism of DGEBA/nickel-imidazole system

Thermochimica Acta

Volumn 468, Issue 1-2, 2008, Pages 39-48

  Omrani, Abdollah ^a,b   Simon, Leonardo C ^a   Rostami, Abbas A ^b   Ghaemy, Mousa ^b  

^a UNIVERSITY OF WATERLOO   (Canada)

^b UNIVERSITY OF MAZANDARAN   (Iran)

Author keywords

Calorimetry; Curing mechanism; Epoxy; FT IR; Nickel imidazole

Indexed keywords

CALORIMETRY; CURING; ENTHALPY; EXOTHERMIC REACTIONS; GLASS TRANSITION; PHENOLS; POLYMERIZATION; SUPERCONDUCTING TRANSITION TEMPERATURE;

CURING MECHANISM; NICKEL IMIDAZOLE; REACTION ENTHALPY;

NICKEL COMPOUNDS;

EID: 39149085989     PISSN: 00406031     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tca.2007.11.016     Document Type: Article

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