SCOPUS 정보 검색 플랫폼

Solid State Sciences

Volumn 13, Issue 3, 2011, Pages 548-552

Behaviors of ZnO-doped silver thick film and silver grain growth mechanism

(4) Wu, S P a Zhao, Q Y a Zheng, L Q a Ding, X H b

a SOUTH CHINA UNIVERSITY OF TECHNOLOGY (China)

b Shenzhen Zhenhua Ferrite and Ceramic Electronics Co Ltd (China)

Author keywords

Electrical conductivity; Ferrite; Grain growth; Silver paste; ZnO powders

Indexed keywords

ADHESIVE STRENGTH; CO-FIRING; ELECTRICAL CONDUCTIVITY; EXPERIMENTAL DATA; GRAIN GROWTH EXPONENT; GRAIN SIZE; GREEN TAPE; GROWTH MECHANISMS; PINNING EFFECTS; SEM; SHEET RESISTIVITY; SILVER FILM; SILVER PASTE; SILVER PASTES; ZNO; ZNO POWDER;

ACTIVATION ENERGY; ELECTRIC CONDUCTIVITY; FERRITE; FERRITES; FILM GROWTH; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MASS TRANSPORTATION; PHOTOGRAPHY; POWDERS; SILVER; THICK FILMS; ZINC OXIDE;

GRAIN GROWTH;

EID: 79952038872 PISSN: 12932558 EISSN: None Source Type: Journal
DOI: 10.1016/j.solidstatesciences.2010.12.024 Document Type: Article

Times cited : (12)

References (21)

1
- 20844432325
- V. Deshpande, A. Kshirsagar, S. Rane, T. Seth, G.J. Phatak, U.P. Mulik, and D.P. Amalnerkar Mater. Chem. Phys. 93 2005 320 324
- (2005) Mater. Chem. Phys. , vol.93 , pp. 320-324
- Deshpande, V.¹ Kshirsagar, A.² Rane, S.³ Seth, T.⁴ Phatak, G.J.⁵ Mulik, U.P.⁶ Amalnerkar, D.P.⁷

2
- 31644443392
- D.H. Ima, S.H. Hyuna, S.Y. Park, B.Y. Lee, and Y.H. Kim Mater. Chem. Phys. 96 2006 228 233
- (2006) Mater. Chem. Phys. , vol.96 , pp. 228-233
- Ima, D.H.¹ Hyuna, S.H.² Park, S.Y.³ Lee, B.Y.⁴ Kim, Y.H.⁵

3
- 33747430787
- S.P. Wu, H.L. Qin, and P. Li J. Univ. Sci. Technol. Beijing 13 2006 250 255
- (2006) J. Univ. Sci. Technol. Beijing , vol.13 , pp. 250-255
- Wu, S.P.¹ Qin, H.L.² Li, P.³

4
- 78649728746
- S.P. Wu, J. Ni, L. Jiao, and Z.O. Zeng Mater. Chem. Phys. 105 2007 71 75
- (2007) Mater. Chem. Phys. , vol.105 , pp. 71-75
- Wu, S.P.¹ Ni, J.² Jiao, L.³ Zeng, Z.O.⁴

5
- 79952040113
- S.Y. Luo, N. Wang, W.C. Xu, and Y. Lv Mater. Chem. Phys. 111 2008 20 23
- (2008) Mater. Chem. Phys. , vol.111 , pp. 20-23
- Luo, S.Y.¹ Wang, N.² Xu, W.C.³ Lv, Y.⁴

6
- 55649109180
- D.S. Seo, S.H. Park, and J.K. Lee Appl. Phys. 9 2009 S72 S74
- (2009) Appl. Phys. , vol.9
- Seo, D.S.¹ Park, S.H.² Lee, J.K.³

7
- 37149033683
- H.W. Lin, C.P. Chang, W.H. Wu, and M.D. Ger J. Mater. Process. Technol. 197 2008 284 291
- (2008) J. Mater. Process. Technol. , vol.197 , pp. 284-291
- Lin, H.W.¹ Chang, C.P.² Wu, W.H.³ Ger, M.D.⁴

8
- 0035372111
- R.Z. Zuo, L.T. Li, and Z.L. Gui Mater. Chem. Phys. 70 2001 326 329
- (2001) Mater. Chem. Phys. , vol.70 , pp. 326-329
- Zuo, R.Z.¹ Li, L.T.² Gui, Z.L.³

9
- 33751056967
- Y.C. Lee, C.T. Lee, S. Wang, and F.S. Shieu Mater. Chem. Phys. 100 2006 355 360
- (2006) Mater. Chem. Phys. , vol.100 , pp. 355-360
- Lee, Y.C.¹ Lee, C.T.² Wang, S.³ Shieu, F.S.⁴

10
- 0035526541
- Y.H. Park, J.M. Ryu, M.Y. Shin, and K.H. Ko J. Am. Ceram. Soc. 84 2001 2542 2546
- (2001) J. Am. Ceram. Soc. , vol.84 , pp. 2542-2546
- Park, Y.H.¹ Ryu, J.M.² Shin, M.Y.³ Ko, K.H.⁴

11
- 0035246687
- C.L. Huang, M.H. Weng, C.C. Wu, and C.C. Wei Jpn. J. Appl. Phys. 40 2001 698 702
- (2001) Jpn. J. Appl. Phys. , vol.40 , pp. 698-702
- Huang, C.L.¹ Weng, M.H.² Wu, C.C.³ Wei, C.C.⁴

12
- 0034322947
- M. Valant, and D. Suvorov J. Am. Ceram. Soc. 83 2000 2721 2729
- (2000) J. Am. Ceram. Soc. , vol.83 , pp. 2721-2729
- Valant, M.¹ Suvorov, D.²

13
- 0016472945
- R.E. Hummel, and H.J. Geier Thin Solid Films 25 1975 335 342
- (1975) Thin Solid Films , vol.25 , pp. 335-342
- Hummel, R.E.¹ Geier, H.J.²

14
- 0034504725
- Rand Dannenberg, E. Stach, J.R. Groza, and B.J. Dresser Thin Solid Films 379 2000 133 138
- (2000) Thin Solid Films , vol.379 , pp. 133-138
- Dannenberg, R.¹ Stach, E.² Groza, J.R.³ Dresser, B.J.⁴

15
- 0031140831
- T.R. Malow, and C.C. Koch Acta Mater. 45 1997 2177 2186
- (1997) Acta Mater. , vol.45 , pp. 2177-2186
- Malow, T.R.¹ Koch, C.C.²

16
- 9944260796
- S.P. Wu, and S.Y. Meng Mater. Chem. Phys. 89 2005 423 427
- (2005) Mater. Chem. Phys. , vol.89 , pp. 423-427
- Wu, S.P.¹ Meng, S.Y.²

17
- 0030084414
- J.K. Tsai, and T.B. Wu Mater. Lett. 26 1995 199 203
- (1995) Mater. Lett. , vol.26 , pp. 199-203
- Tsai, J.K.¹ Wu, T.B.²

18
- 37349049606
- K. Park, D. Seo, and J. Lee Colloids Surf. A Physicochem. Eng. Aspects 313-314 2008 351 354
- (2008) Colloids Surf. A Physicochem. Eng. Aspects , vol.313-314 , pp. 351-354
- Park, K.¹ Seo, D.² Lee, J.³

19
- 33344476969
- C.L. Miao, M. Wang, Z.X. Yue, J. Zhou, and Q. Li Ceram. Int. 32 2006 471 474
- (2006) Ceram. Int. , vol.32 , pp. 471-474
- Miao, C.L.¹ Wang, M.² Yue, Z.X.³ Zhou, J.⁴ Li, Q.⁵

20
- 70350182227
- B.K. Landry, P.L. Nadworny, O.E. Omotoso, Y. Mahama, J.C. Burrell, and R.E. Burrell Biomaterials 30 2009 6929 6939
- (2009) Biomaterials , vol.30 , pp. 6929-6939
- Landry, B.K.¹ Nadworny, P.L.² Omotoso, O.E.³ Mahama, Y.⁴ Burrell, J.C.⁵ Burrell, R.E.⁶

21
- 0026404830
- S.K. Ganapathi, D.M. Owen, and A.H. Chockski Scr. Metall. Mater. 25 1991 2699 2704
- (1991) Scr. Metall. Mater. , vol.25 , pp. 2699-2704
- Ganapathi, S.K.¹ Owen, D.M.² Chockski, A.H.³

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.