Properties of lead-free conductive thick films of co-precipitated silver-palladium powders

Materials Chemistry and Physics

Volumn 93, Issue 2-3, 2005, Pages 320-324

  Deshpande, V ^a   Kshirsagar, A ^a   Rane, S ^a   Seth, T ^a   Phatak, G J ^a   Mulik, U P ^a   Amalnerkar, D P ^a  

^a CENTRE FOR MATERIALS FOR ELECTRONICS TECHNOLOGY C MET   (India)

Author keywords

Alloy; Co precipitation; Lead free; Metal powders; Microstructure; Thick film

Indexed keywords

DIFFERENTIAL THERMAL ANALYSIS; ENERGY DISPERSIVE SPECTROSCOPY; LEAD; MICROSTRUCTURE; PALLADIUM; PARTICLE SIZE ANALYSIS; POWDER METALS; PRECIPITATION (CHEMICAL); SCANNING ELECTRON MICROSCOPY; SILVER; SINTERING; THERMOGRAVIMETRIC ANALYSIS; THICK FILMS; X RAY DIFFRACTION;

BATH TEMPERATURE; CO-PRECIPITATION; LEAD-FREE; SILVER-PALLADIUM POWDERS;

CONDUCTIVE FILMS;

EID: 20844432325     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchemphys.2005.03.018     Document Type: Article

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