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Volumn 88, Issue 4, 2011, Pages 499-502
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Germanium substrate loss during thermal processing
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Author keywords
Annealing; Doping profiles; Elemental semiconductors; Germanium; Thermal etching
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Indexed keywords
ARRHENIUS LAW;
BULK MATERIALS;
CAPPING LAYER;
DESORPTION RATE;
DIRECT-EVAPORATION;
DOPING PROFILES;
ELEMENTAL SEMICONDUCTORS;
GERMANIUM DIOXIDE;
GERMANIUM SUBSTRATES;
HIGH CARRIER MOBILITY;
LOW VAPOR PRESSURES;
P-N JUNCTION;
PATTERNED SILICON;
SUBSTRATE LOSS;
SURFACE DEGRADATION;
THERMAL ETCHING;
THERMAL PROCESSING;
ACTIVATION ENERGY;
ANNEALING;
CARRIER MOBILITY;
DESORPTION;
ETCHING;
EVAPORATION;
ION IMPLANTATION;
OXYGEN;
SEMICONDUCTOR DEVICES;
SEMICONDUCTOR DOPING;
SILICA;
SUBSTRATES;
SURFACE ROUGHNESS;
WATER VAPOR;
GERMANIUM;
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EID: 79751535393
PISSN: 01679317
EISSN: None
Source Type: Journal
DOI: 10.1016/j.mee.2010.08.031 Document Type: Conference Paper |
Times cited : (31)
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References (17)
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