-
1
-
-
0031095713
-
-
10.1149/1.1837505
-
V. M. Dubin, Y. Shacham-Diamand, B. Zhao, and P. K. Vasudev, J. Electrochem. Soc., 144, 898 (1997). 10.1149/1.1837505
-
(1997)
J. Electrochem. Soc.
, vol.144
, pp. 898
-
-
Dubin, V.M.1
Shacham-Diamand, Y.2
Zhao, B.3
Vasudev, P.K.4
-
3
-
-
0026912069
-
-
10.1149/1.2221249
-
M. Matsuoka, J. Murai, and C. Iwakura, J. Electrochem. Soc., 139, 2466 (1992). 10.1149/1.2221249
-
(1992)
J. Electrochem. Soc.
, vol.139
, pp. 2466
-
-
Matsuoka, M.1
Murai, J.2
Iwakura, C.3
-
5
-
-
0042389564
-
-
10.1021/la034748h
-
E. Delamarche, J. Vichiconti, S. A. Hall, M. Geissler, W. Graham, B. Michel, and R. Nunes, Langmuir, 19, 6567 (2003). 10.1021/la034748h
-
(2003)
Langmuir
, vol.19
, pp. 6567
-
-
Delamarche, E.1
Vichiconti, J.2
Hall, S.A.3
Geissler, M.4
Graham, W.5
Michel, B.6
Nunes, R.7
-
6
-
-
13844306870
-
Metallization improvement on fabrication of interdigitated backside and double sided buried contact solar cells
-
DOI 10.1016/j.solmat.2004.09.001, PII S0927024804003083
-
J. H. Guo and J. E. Cotter, Sol. Energy Mater. Sol. Cells, 86, 485 (2005). 10.1016/j.solmat.2004.09.001 (Pubitemid 40259543)
-
(2005)
Solar Energy Materials and Solar Cells
, vol.86
, Issue.4
, pp. 485-498
-
-
Guo, J.-H.1
Cotter, J.E.2
-
8
-
-
12344281454
-
Electroless plating of glass and silicon substrates through surface pretreatments involving plasma-polymerization and grafting processes
-
DOI 10.1080/00218460490884132
-
M. Charbonnier, Y. Goepfert, M. Romand, and D. Leonard, J. Adhes., 80, 1103 (2004). 10.1080/00218460490884132 (Pubitemid 40134402)
-
(2004)
Journal of Adhesion
, vol.80
, Issue.12
, pp. 1103-1130
-
-
Charbonnier, M.1
Goepfert, Y.2
Romand, M.3
Leonard, D.4
-
9
-
-
0035801732
-
Study of mechanism of electroless copper coating of fly-ash cenosphere particles
-
DOI 10.1016/S0169-4332(01)00341-5, PII S0169433201003415
-
S. Shukla, S. Seal, J. Akesson, R. Oder, R. Carter, and Z. Rahman, Appl. Surf. Sci., 181, 35 (2001). 10.1016/S0169-4332(01)00341-5 (Pubitemid 32804945)
-
(2001)
Applied Surface Science
, vol.181
, Issue.1-2
, pp. 35-50
-
-
Shukla, S.1
Seal, S.2
Akesson, J.3
Oder, R.4
Carter, R.5
Rahman, Z.6
-
10
-
-
0019020761
-
-
10.1149/1.2129810
-
T. Osaka, H. Takamatsu, and K. Nihei, J. Electrochem. Soc., 127, 1021 (1980). 10.1149/1.2129810
-
(1980)
J. Electrochem. Soc.
, vol.127
, pp. 1021
-
-
Osaka, T.1
Takamatsu, H.2
Nihei, K.3
-
11
-
-
33644752848
-
Influence of the polymer pre-treatment before its electroless metallization
-
DOI 10.1016/j.surfcoat.2005.01.095, PII S0257897205001830
-
D. Nicolas-Debarnot, M. Pascu, C. Vasile, and F. Poncin-Epaillard, Surf. Coat. Technol., 200, 4257 (2006). 10.1016/j.surfcoat.2005.01.095 (Pubitemid 43335992)
-
(2006)
Surface and Coatings Technology
, vol.200
, Issue.14-15
, pp. 4257-4265
-
-
Nicolas-Debarnot, D.1
Pascu, M.2
Vasile, C.3
Poncin-Epaillard, F.4
-
12
-
-
0024080189
-
-
10.1147/rd.325.0591
-
E. J. M. O'Sullivan, J. Horkans, J. R. White, and J. M. Roldan, IBM J. Res. Dev., 32, 591 (1988). 10.1147/rd.325.0591
-
(1988)
IBM J. Res. Dev.
, vol.32
, pp. 591
-
-
O'Sullivan, E.J.M.1
Horkans, J.2
White, J.R.3
Roldan, J.M.4
-
14
-
-
79551595912
-
-
in, K. Vaidyanathan, T. Y. Tee, and T. K. Lee, Editors, Electronics Packaging Technology Conference Proceedings, Singapore.
-
X. Y. Cui, D. Bhatt, D. A. Hutt, K. Williams, and P. P. Conway, in Manufacturing Process, K. Vaidyanathan, T. Y. Tee, and, T. K. Lee, Editors, p. 37, Electronics Packaging Technology Conference Proceedings, Singapore (2007).
-
(2007)
Manufacturing Process
, pp. 37
-
-
Cui, X.Y.1
Bhatt, D.2
Hutt, D.A.3
Williams, K.4
Conway, P.P.5
-
15
-
-
15044357451
-
Electroless plating of copper through successive pretreatment with silane and colloidal silver
-
DOI 10.1016/j.colsurfa.2004.10.036, PII S0927775704007435, A Selection of Papers from the 10th International Conference on Organised Molecular Film
-
Z. C. Liu, Q. G. He, P. Hou, P. F. Xiao, N. Y. He, and Z. H. Lu, Colloids Surf., A, 257-258, 283 (2005). 10.1016/j.colsurfa.2004.10.036 (Pubitemid 40379706)
-
(2005)
Colloids and Surfaces A: Physicochemical and Engineering Aspects
, vol.257-258
, pp. 283-286
-
-
Liu, Z.-C.1
He, Q.-G.2
Hou, P.3
Xiao, P.-F.4
He, N.-Y.5
Lu, Z.-H.6
-
16
-
-
0032640410
-
-
10.1149/1.1391757
-
Y.-H. Zhang, T.-T. Yan, S.-Q. Yu, and S.-Y. Zhuang, J. Electrochem. Soc., 146, 1270 (1999). 10.1149/1.1391757
-
(1999)
J. Electrochem. Soc.
, vol.146
, pp. 1270
-
-
Zhang, Y.-H.1
Yan, T.-T.2
Yu, S.-Q.3
Zhuang, S.-Y.4
-
17
-
-
0037703303
-
-
10.1021/la0341714
-
E. Delamarche, M. Geissler, J. Vichiconti, W. S. Graham, P. A. Andry, J. C. Flake, P. M. Fryer, R. W. Nunes, B. Michel, E. J. O'Sullivan, Langmuir, 19, 5923 (2003). 10.1021/la0341714
-
(2003)
Langmuir
, vol.19
, pp. 5923
-
-
Delamarche, E.1
Geissler, M.2
Vichiconti, J.3
Graham, W.S.4
Andry, P.A.5
Flake, J.C.6
Fryer, P.M.7
Nunes, R.W.8
Michel, B.9
O'Sullivan, E.J.10
-
18
-
-
0038276992
-
-
10.1016/S0040-6090(03)00274-8
-
L. Xu, J. Liao, L. Huang, D. Ou, Z. Guo, H. Zhang, C. Ge, N. Gu, and J. Liu, Thin Solid Films, 434, 121 (2003). 10.1016/S0040-6090(03)00274-8
-
(2003)
Thin Solid Films
, vol.434
, pp. 121
-
-
Xu, L.1
Liao, J.2
Huang, L.3
Ou, D.4
Guo, Z.5
Zhang, H.6
Ge, C.7
Gu, N.8
Liu, J.9
-
19
-
-
0003459529
-
-
Physical Electronics, Inc., New York.
-
J. F. Moulder, W. F. Stickle, P. E. Sobot, and K. D. Bomben, Handbook of X-Ray Photoelectron Spectroscopy, Physical Electronics, Inc., New York (1995).
-
(1995)
Handbook of X-Ray Photoelectron Spectroscopy
-
-
Moulder, J.F.1
Stickle, W.F.2
Sobot, P.E.3
Bomben, K.D.4
-
20
-
-
0029392284
-
-
10.1149/1.2049989
-
M. Froment, E. Queau, J. R. Martin, and G. Stremsdoerfer, J. Electrochem. Soc., 142, 3373 (1995). 10.1149/1.2049989
-
(1995)
J. Electrochem. Soc.
, vol.142
, pp. 3373
-
-
Froment, M.1
Queau, E.2
Martin, J.R.3
Stremsdoerfer, G.4
-
21
-
-
79551608824
-
-
Isotope peak, I.v.s.i. ToF-SIMS, ION-ToF GmbH, Münster, Germany.
-
Isotope peak, I.v.s.i. ToF-SIMS, ION-ToF GmbH, Münster, Germany.
-
-
-
|