Materials modeling and finite element simulation of isothermal forging of electrolytic copper

Materials and Design

Volumn 32, Issue 4, 2011, Pages 1851-1858

  Prasad, Y V R K ^a   Rao, K P ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Forging (C); Non ferrous metals and alloys (A); Plastic behavior (F)

Indexed keywords

CONSTITUTIVE EQUATIONS; COPPER; DYNAMIC RECRYSTALLIZATION; ELECTROLYTIC ANALYSIS; FORGING; GRAIN SIZE AND SHAPE; HOT WORKING; ISOTHERMS;

DYNAMIC RECRYSTALLIZATION (DRX); FINITE ELEMENT SIMULATIONS; ISOTHERMAL FORGING; NON-FERROUS METALS AND ALLOYS; PLASTIC BEHAVIOR; RATE-CONTROLLING MECHANISM; RECRYSTALLIZED GRAINS; STEADY-STATE FLOWS;

FINITE ELEMENT METHOD;

EID: 79251639152     PISSN: 02613069     EISSN: 18734197     Source Type: Journal    
DOI: 10.1016/j.matdes.2010.12.018     Document Type: Article

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