Processing maps and rate controlling mechanisms of hot deformation of electrolytic tough pitch copper in the temperature range 300-950 °C

Materials Science and Engineering: A

Volumn 391, Issue 1-2, 2005, Pages 141-150

  Prasad, Y V R K ^a   Rao, K P ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Dynamic recrystallization; Electrolytic copper; Hot deformation; Kinetic analysis; Processing maps

Indexed keywords

ACTIVATION ENERGY; DEFORMATION; DIFFUSION; ELECTROLYTIC ANALYSIS; HOT PRESSING; RECRYSTALLIZATION (METALLURGY); STRAIN; TEMPERATURE DISTRIBUTION;

ELECTROLYTIC TOUCH PITCH (ETP); KINETIC ANALYSIS; PLASTIC STRAINS; RATE CONTROL;

COPPER;

COPPER; DEFORMATION;

EID: 11344276580     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2004.08.049     Document Type: Article

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