Integration of vertical carbon nanotube bundles for interconnects

Journal of the Electrochemical Society

Volumn 157, Issue 10, 2010, Pages

  Chiodarelli, Nicoló ^a,b   Kellens, Kristof ^a   Cott, Daire J ^a   Peys, Nick ^a,c   Arstila, Kai ^a   Heyns, Marc ^a,c   De Gendt, Stefan ^a,c   Groeseneken, Guido ^a,b   Vereecken, Philippe M ^a  

^a IMEC   (Belgium)

^b Katholieke Universiteit Leuven   (Belgium)

^c UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON NANOTUBE BUNDLE; CONTACT HOLES; DEPOSITION METHODS; ELECTRICAL CHARACTERIZATION; ELECTRICALLY CONDUCTIVE; FUTURE GENERATIONS; INTEGRATION PROCESS; METAL DECORATION; NICKEL CATALYST; OXIDE MATRIX; PHYSICAL VAPOR DEPOSITED; POLISHING STEPS; PRACTICAL IMPLEMENTATION; PROCESSING ENVIRONMENTS; PROMISING MATERIALS; TOP CONTACT;

CATALYSTS; COBALT; TUNGSTEN;

CARBON NANOTUBES;

EID: 77956222764     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3473810     Document Type: Article

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