Temporary bond-debond process for manufacture of flexible electronics: Impact of adhesive and carrier properties on performance

Journal of Applied Physics

Volumn 108, Issue 11, 2010, Pages

  Haq, Jesmin ^a,b   Ageno, Scott ^a   Raupp, Gregory B ^b   Vogt, Bryan D ^a,b   Loy, Doug ^a  

^a ARIZONA STATE UNIVERSITY   (United States)

^b AZ 85281   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMATED HANDLING; BONDED SYSTEMS; BONDING ADHESIVE; COEFFICIENT OF THERMAL EXPANSION; ELECTRONICS FABRICATION; ETCH PROCESS; FLEXIBLE CIRCUITRY; FLEXIBLE MICROELECTRONICS; FLEXIBLE SUBSTRATE; HIGH YIELD; LOW LOSS; LOW STRESS; PLASTIC SUBSTRATES; STRUCTURAL SUPPORT; THERMOMECHANICAL PROPERTIES; VISCOELASTIC PROPERTIES;

ALIGNMENT; FABRICATION; FLEXIBLE ELECTRONICS; FLEXIBLE MANUFACTURING SYSTEMS; MICROELECTRONICS; THERMAL EXPANSION;

SUBSTRATES;

EID: 78751565475     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3517145     Document Type: Article

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