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Volumn 108, Issue 11, 2010, Pages

Temporary bond-debond process for manufacture of flexible electronics: Impact of adhesive and carrier properties on performance

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMATED HANDLING; BONDED SYSTEMS; BONDING ADHESIVE; COEFFICIENT OF THERMAL EXPANSION; ELECTRONICS FABRICATION; ETCH PROCESS; FLEXIBLE CIRCUITRY; FLEXIBLE MICROELECTRONICS; FLEXIBLE SUBSTRATE; HIGH YIELD; LOW LOSS; LOW STRESS; PLASTIC SUBSTRATES; STRUCTURAL SUPPORT; THERMOMECHANICAL PROPERTIES; VISCOELASTIC PROPERTIES;

EID: 78751565475     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3517145     Document Type: Article
Times cited : (33)

References (21)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.